www.fairchildsemi.com ? 2009 fairchild semiconductor corporation www.fairchildsemi.com rev. 1.0.2 ? 4/7/11 an9072 smart power module motionspm? in minidip spm ? ?? ? mounting guidance mounting guidance this application note shows the electric spacing an d mounting guidance of minidip spm. electric spacing the electric spacing specification of minidip spm is shown in table 1. table 1. typical electric spacing of minidip spm clearance [mm] creepage distance [mm] between power terminals 3.08 3.28 between control terminals 2.35 4.95 between terminals & heat sink 2.05 2.05 mounting method and precautions when installing a module to a heat sink, excessive uneven fastening force might apply stress to inside chips, which can lead to damage or degradation of the device. an exa mple of recommended fastening order is shown in figure 1. figure 1. mounting screws fastening order: prescrewing: 1 2; final screwing: 2 1 notes: 1. do not over torque when mounting screws. excess mounting torque may cause ceramic cracks, as well a s screw and heat-sink damage. 2. avoid one-side tightening stress, figure 1 shows the recommended torque order for mounting screws. uneven mounting can cause the spm ceramic substrate to be damaged. the pre-screwing torque is set to 20~30% of maximum torque rating. table 2. mounting torque and heat sink flatness spe cifications parameter conditions limits units min. typ. max. device flatness see figure 2 0 +120 m heat sink flatness see figure 3 -50 +100 m mounting torque screw: m3 recommended 0.7nm 0.6 0.7 0.8 nm recommended 7.1kgm 6.2 7.1 8.1 kgcm weight 11 g note: 3. recommend using sems screw (include spring/plain washer, m3) in fastening screws.
AN-9072 application note ? 2009 fairchild semiconductor corporation www.fairchildsemi.com rev. 1.0.2 ? 4/7/11 2 figure 2. measurement point of package surface flatness note: 4. the measurement point of flatness of the package surface is package center point compared with outsi de four points. figure 3. measurement point of heat sink flatness to get the most effective heat dissipation, it is n ecessary to enlarge the contact area as much as possible, which minimizes the contact thermal resistance. properly apply thermalconductive grease over the c ontact surface between a module and heat sink, which is al so useful for preventing the contact surface from corrosion. ensure the grease has stable quality and longterm enduran ce within a wide operating temperature range. use a torque wr ench to fasten up to the specified to torque rating. exceed ing the maximum torque limitation might cause a module to b e damaged or degraded. pay careful attention not to h ave any dirt remaining on the contact surface. thermal compound use a minimum 150m layer of thermal grease to the module base plate or to the heat sink. while fastening the module, a rim of thermal compou nd must be observed around the mounted module. fixing sequence fix all screws 0.5nm under (by hand or driver). apply impact torque maximum 0.8n m crosswise. use recommended sems screw (included spring/plain washer m3). figure 4. sems screw (size m3, spring washer 5.0, plain washer 7.5)
AN-9072 application note ? 2009 fairchild semiconductor corporation www.fairchildsemi.com rev. 1.0.2 ? 4/7/11 3 related datasheets fnx4xx60x smart power module motion-spm? an-9070 smart power module motion-spm? in mini-d ip spm ? user guide an-9071 smart power module motion-spm? in mini-d ip spm ? thermal performance information disclaimer fairchild semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function, or design. fairchild does not assume any liability arising ou t of the application or use of any product or circuit descri bed herein; neither does it convey any license unde r its patent rights, nor the rights of others. life support policy fairchilds products are not authorized for use as critical components in life support devices or syst ems without the express written approval of the preside nt of fairchild semiconductor corporation. as used herein: 1. life support devices or systems are devices or s ystems which, (a) are intended for surgical implant into t he body, or (b) support or sustain life, or (c) whose failure t o perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expecte d to result in significant injury to the user. 2. a critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the lif e support device or system, or to affect its safety or effect iveness.
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